Modeling and numerical simulation of the thermomechanical cyclical behavior of a cross-ply MMC

Citation
H. Ismar et F. Schroter, Modeling and numerical simulation of the thermomechanical cyclical behavior of a cross-ply MMC, COMP MAT SC, 16(1-4), 1999, pp. 259-266
Citations number
15
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
COMPUTATIONAL MATERIALS SCIENCE
ISSN journal
09270256 → ACNP
Volume
16
Issue
1-4
Year of publication
1999
Pages
259 - 266
Database
ISI
SICI code
0927-0256(199912)16:1-4<259:MANSOT>2.0.ZU;2-L
Abstract
In the current study the thermomechanical behavior of an aluminum alloy rei nforced bidirectionally with SiC-fibers is numerically investigated by usin g the finite element method. A three-dimensional unit cell can be derived f rom a geometrical idealization of the fiber arrangement. Special emphasis i s placed on the inelastic material behavior of the metallic matrix because of its strong influence on the composite behavior. Therefore a comprehensiv e viscoplastic unified model is proposed, which permits an improved materia l description by using the transition flow potential (TFP). Cooling process es during manufacture induce a pronounced inhomogeneous residual stress sta te in the composite resulting in local inelastic matrix deformation. These stresses have a considerable influence on the mechanical behavior, so that different attitudes under tension and compression can be observed. Under cy clical mechanical loading with a constant strain amplitude simulations show an increase of the residual strain (ratchetting) and a narrowing of the hy steresis loop with increasing cycle number. Residual stresses induced durin g manufacture cause an asymmetric hysteresis with varying magnitude and tem poral development of maximum and minimum averaged stresses. Cyclical behavi or of composites is strongly influenced by a superposed thermal loading, wh ereby it must be distinguished whether the thermal load is in-phase or out- of-phase to the mechanical load. (C) 1999 Elsevier Science B.V. All rights reserved.