An integrated modeling approach to solder joint formation

The attachment of electronic components to printed circuit boards using sol der material is a complex process. This paper presents a novel modeling met hodology, which integrates the governing physics taking place. Multiphysics modeling technology, imbedded into the simulation tool-PHYSICA is used to simulate fluid flow, heat transfer, solidification, and stress evolution in an integrated manner. Results using this code are presented, detailing the mechanical response of two solider materials as they cool, solidify and th en deform. The shape that a solder joint takes upon melting is predicted us ing the SURFACE EVOLVER code. Details are given on how these predictions ca n be used in the PHYSICA code to provide a modeling route by which the shap e, solidification history, and resulting stress profiles can be predicted.