Pulse crosstalk analysis of bondwires in high-speed plastic packages

Pulse transmission integrity and crosstalk of bondwires buried in plastic p ackages are analyzed using the method of moments and the Fourier transform algorithm, showing that the quasi-static crosstalk model of simulation prog ram with integrated circuit emphasis (SPICE) is inappropriate for designing high-speed plastic packages. Plastic packaging material, which increases t he self and mutual capacitances. is found to be helpful for pulse transmiss ion integrity due to the dielectric compensation effect. However, it is als o observed that the plastic material increases the pulse crosstalk due to t he radiation-enhanced mutual coupling effect. By investigating the geometri cal and material dependence of the pulse transmission and crosstalk, we obs erve that the radiation-enhanced coupling effect is significant for most ty pical bondwire geometries in common plastic molding materials. These calcul ation results can be effectively used for designing plastic-mold packages o f high-speed digital integrated circuits and monolithic radio frequency int egrated circuits (RFICs).