Modeling of the mechanical behavior of materials in "high-tech" systems: Attributes and review

Authors
Citation
E. Suhir, Modeling of the mechanical behavior of materials in "high-tech" systems: Attributes and review, J ELEC PACK, 121(4), 1999, pp. 213-221
Citations number
102
Categorie Soggetti
Mechanical Engineering
Journal title
JOURNAL OF ELECTRONIC PACKAGING
ISSN journal
10437398 → ACNP
Volume
121
Issue
4
Year of publication
1999
Pages
213 - 221
Database
ISI
SICI code
1043-7398(199912)121:4<213:MOTMBO>2.0.ZU;2-P
Abstract
We examine some attributes of modeling of the mechanical behavior of materi als and structures in microelectronics and photonics (mainly fiber optics) engineering. The merits and shortcomings of experimental and theoretical mo deling are addressed, as well as the interaction between different modeling approaches. The concepts discussed are illustrated by a brief review of th e published work in the field. The review is based primarily on the author' s research conducted during his work at Bell Laboratories and reflects, to a gr-eat extent, the state-of-the-art in modeling of the mechanical behavio r of "high-tech" materials and structures.