Investigation of a new lead free solder alloy using thin strip specimens

The theromechanical behaviors of a new lead free solder and eutectic 63Sn37 Pb are investigated in this paper: A series of tests including tensile, cre ep, and fatigue, are carried out on a computer controlled 6-axis mini-fatig ue tester. The thin strip specimen is used in this research, which is speci ally designed and verified to be suitable for the resting of solder alloys and comparable to the data from the literature. Based on the experimental s tudy, the new lead free solder alloy shows very attractive characteristics and may have potential applications in electronics packaging products.