T. Winkler et al., Consideration of parameter scattering in thermo-mechanical characterization of advanced packages, J ELEC PACK, 121(4), 1999, pp. 282-285
Much progress has been made in the simulation and verification of the therm
o-mechancial behavior of plastic packages. On the other hand, until now the
re is a lack in the consideration of the scatter or uncertanity, respective
ly, of certain characteristics. A comparatively large scatter of local mate
rial properties or random geometrical imperfections can often be observed w
ithin the material compounds of electronic packages. The partial randomness
of certain input parameters creates uncertainties in the finite element de
termination of mechanical quantities which are provided for thermo-mechanic
al reliability optimization and life time prediction. In the following the
STOFEM stochastic finite element approach based on perturbation theory is a
pplied as a part of the finite element simulation. It is used to find out s
ome additional effects arising from uncertanities in the modeling, slightly
varying parameter or probabilistic influences, respectively. In a second p
art of the paper, another approach to the consideration of ramdom variation
s is discussed. It is based on the randomization of initially deterministic
relations.