Experimental modeling of the cure kinetics of an epoxy-hexaanhydro-4-methylphthalicanhydride (MHHPA) system

The DEBGA-MHHPA epoxy system has found increasing applications in microelec tronics packaging for which the ability to understand and model the cure ki netics mechanism accurately is crucial. The present paper reports on the wo rk carried out to elucidate an accurate cure kinetics model for the DEBGA-M HHPA epoxy system, using both the isothermal and non-isothermal DSC methods . The results indicates that both the Kissinger and Ozawa's methods for cal culating the activation energy value gave fairly close results of 71.6 and 74.7 kJ/mol, respectively. A autocatalytic model with a total order of reac tion of about 2.5 was successfully used to model the process. (C) 1999 Else vier Science Ltd. All rights reserved.