Metal incorporated carbon films (Me-C:H) were deposited using a new techniq
ue with two W screen grids incorporated inside an electron cyclotron resona
nce chemical vapour deposition (ECR-CVD) chamber. This technique is versati
le when applied to the deposition of Me-C:H films as the degree of plasma i
onisation, the sputtering rate of the metal grids and the energy of the imp
inging ions can be independently controlled. In this work, the proposed tec
hnique is demonstrated through W-C:H deposition at different flow ratios of
CH4 to Ar. A DC bias of - 330V was applied to the upper and lower grids wi
th either the substrate floating or under direct DC bias. The films were ch
aracterised in terms of their conductivity, atomic concentration (RBS), ato
mic configuration(XPS and XRD), hardness and optical absorption. The resist
ivities and the optical gaps of the films were noted to decrease drasticall
y upon incorporation of several atomic percentage of W. WC formation is onl
y observed for films deposited with the substrate under direct DC bias. (C)
1999 Elsevier Science S.A. All rights reserved.