J. Bouchet et al., Internal stresses, Young's modulus and practical adhesion of organic coatings applied onto 5754 aluminium alloy, THIN SOL FI, 356, 1999, pp. 270-276
Residual stress, Young's modulus and practical adhesion of different thickn
ess organic layers made of DGEBA epoxy resin and TPD hardener were determin
ed. Coatings were deposited on aluminum alloy (5754) after degreasing and c
hemical etching. Both bi-layer (having a perfect interface with a null thic
kness) and three-layer models (having a real interphase between the organic
coating and the substrate) were considered to evaluate residual stress and
Young's modulus of the entire coating, the polymer/metal interphase and th
e remaining part of the coating which have the bulk properties. Coatings, i
nterphase and bulk properties (T-g, reaction extent and interphase thicknes
s) were determined by using differential thermal analysis (DSC) and FTNIR s
pectroscopy. Young's modulus, curvature radii of coated samples and practic
al adhesion were determined by three point flexure test. Results show the b
i-layer model limitation when a coating/substrate interphase is formed. Int
erphase thicknesses of 200 and 250 mu m were obtained for respectively degr
easing and chemical etching. For the same coating formulation and the same
curing conditions, amine conversion, T-g of the entire coatings, residual s
tresses at interfaces interphase/metal and bulk coating/interphase, Young's
modulus and practical adhesion depend on the nature of the substrate treat
ment and on the coating thickness. For thick coatings mechanical, physical
and chemical properties are equal to the bulk one. For thin coatings signif
icant differences compared to the bulk properties were observed. Variations
of both residual stress and Young's modulus were observed according to dif
ferent surface treatments. Residual stress intensities at the interphase/su
bstrate interface are higher than the ones at the coating/substrate interfa
ce. For thin coatings on chemically etched substrate, Young's modulus is mo
re important than degreased substrate one. On the contrary, residual stress
intensities are lower for chemical etching than the degreasing ones. When
adhesional failure was observed, the adherence increases when internal stre
sses at the interface between the metal and the formed interphase decrease.
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