D. Wu et al., STRUCTURE, ELECTRICAL AND CHEMICAL-PROPERTIES OF ZIRCONIUM NITRIDE FILMS DEPOSITED BY DC REACTIVE MAGNETRON SPUTTERING, Applied physics A: Materials science & processing, 64(6), 1997, pp. 593-595
Zirconium nitride films were deposited by de re active magnetron sputt
ering at a substrate temperature of 320 degrees C in an N-2 and Ar amb
ient. X-ray diffraction indicated that growth of ZrN with a preferred
(111) orientation over Si(100) was achieved. The resistivity of the fi
lms varies from 200 mu Omega cm to 15 mu Omega cm depending on the N-2
content in the working gas. The square resistance of the films deposi
ted on 96% Al2O3 ceramic wafers is stable below 300 degrees C.