Conduction mechanisms in barium tantalates films and modification of interfacial barrier height

Citation
Yh. Lee et al., Conduction mechanisms in barium tantalates films and modification of interfacial barrier height, IEEE DEVICE, 47(1), 2000, pp. 71-76
Citations number
25
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEEE TRANSACTIONS ON ELECTRON DEVICES
ISSN journal
00189383 → ACNP
Volume
47
Issue
1
Year of publication
2000
Pages
71 - 76
Database
ISI
SICI code
0018-9383(200001)47:1<71:CMIBTF>2.0.ZU;2-G
Abstract
nThe leakage current-voltage characteristics of rf-magnetron sputtered BaTa 2O6 film in a capacitor with the top aluminum: and the bottom indium-tin-ox ide electrodes have been investigated as a function of applied field and te mperature. In order to study the effect of the surface treatment on the ele ctrical characteristics of as-deposited film we performed an oxygen plasma treatment on BaTa2O6 surface. The de current-voltage, bipolar pulse charge- voltage, de current-time, and small ac signal capacitance-frequency charact eristics were measured to study the electrical and the dielectric propertie s of BaTa2O6 thin film. All of the BaTa2O6 films in this study exhibited a low leakage current, a high breakdown field strength (3-4.5 MV/cm), and a h igh dielectric constant (20-30), From the temperature dependence of the lea kage current, we could conclude that the dominant conduction mechanism unde r high electrical fields (>1 MV/cm) is ascribed to the Schottky emission wh ile the ohmic conduction is dominant at low electrical fields (<1 MV/cm). F urthermore, the oxygen plasma treatment on the surface of as-deposited BaTa 2O6 resulted in a lowering of the interface barrier height and thus, a redu ction of the leakage current at Al under a negative bias. This can be expla ined: by the formation of Ba-rich metallic layer by surface etching effect and by filling the oxygen vacancies in the bulk.