New formulas of interconnect capacitances based on results of conformal mapping method

The work presents new formulas for the capacitances of the most common two- dimensional (2-D) interconnect structures. The results have been obtained b y using a physically-based approach: each geometry has been divided into el ementary components studied rigorously with the conformal mapping method. T he capacitances of structures composed by one, two, or three lines on a gro und plane are then written as a weighted sum of such elements, Since the el ementary terms already account for the correct geometrical dependencies, ve ry few numerical simulations have been required to tailor the formulas, att aining an accuracy higher than previously known results, over a wide range of the geometrical parameters of the lines.