Effects of plasma power on the properties of low-k polymerlike organic thin films deposited by plasma-enhanced chemical vapor deposition using the toluene precursor

Authors
Joo, J Quan, YC Jung, DG
Citation
J. Joo et al., Effects of plasma power on the properties of low-k polymerlike organic thin films deposited by plasma-enhanced chemical vapor deposition using the toluene precursor, J MATER RES, 15(1), 2000, pp. 228-230
Citations number
8
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF MATERIALS RESEARCH
ISSN journal
08842914 → ACNP
Volume
15
Issue
1
Year of publication
2000
Pages
228 - 230
Database
ISI
SICI code
0884-2914(200001)15:1<228:EOPPOT>2.0.ZU;2-5
Abstract
Effects of plasma power on the properties of polymerlike organic thin films deposited by plasma-enhanced chemical vapor deposition using the toluene p recursor were studied. As the plasma power was increased from 5 to 60 W, th e relative dielectric constant increased from 2.53 to 2.85. The film deposi ted at higher plasma power showed higher thermal stability. The film deposi ted at 60 W was stable up to 400 degrees C. All the films were insulating u nder applied field less than or equal to 1 MV/cm.