The finite element analysis of internal stresses during sequential build-up of lamination-based thick-film multilayer substrates

The thermomechanical behavior of multilayer structures is a subject of pere nnial interest. Among various multilayer structures, we provided a thorough investigation on the lamination-based thick-film multilayer substrates, or the multichip module substrates. Firstly, we offered an in-depth look at t he composite bean analysis (CBA) recently suggested for thick-film multilay er structures. The calculated substrate bow values using the CBA model were compared with the measured values and calculated values from numerical ana lysis. The magnitude and distribution of biaxial, shear, and peel stresses in thick-film multilayer substrates during sequential build-up of thick-fil m polymer dielectrics were calculated and discussed. Secondly, for users' c onvenience, the most widely-used analytical methods for microelectronics ap plications were summarized along with the CBA model, and their possible app lications were suggested.