Comparison between the reversal temperature of IBIEC-IBIIA transition and critical temperatures of damage formation in ion irradiated InP and InAs

Citation
E. Wendler et al., Comparison between the reversal temperature of IBIEC-IBIIA transition and critical temperatures of damage formation in ion irradiated InP and InAs, NUCL INST B, 160(2), 2000, pp. 257-261
Citations number
18
Categorie Soggetti
Spectroscopy /Instrumentation/Analytical Sciences","Instrumentation & Measurement
Journal title
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS
ISSN journal
0168583X → ACNP
Volume
160
Issue
2
Year of publication
2000
Pages
257 - 261
Database
ISI
SICI code
0168-583X(200002)160:2<257:CBTRTO>2.0.ZU;2-7
Abstract
The critical temperature of damage formation in crystalline semiconductors, T-C, and the reversal temperature T-R of the ion beam induced epitaxial cr ystallization (IBIEC)-ion beam induced interfacial amorphization (IBIIA) tr ansition are studied for ion irradiated InP and InAs. It is shown that both temperatures, T-C and T-R, depend on the number of primary displacements p er ion and unit depth, N-displ*, and on the dose rate j according to (N-dis pl*)(2) j similar to exp(-E-a/kT(C/R)) That means this relation which was f irst derived to explain T-R data of ion irradiation into amorphous/crystall ine interfaces in Si, holds well to describe the critical temperature of da mage formation in crystalline semiconductors, too. The values of E-a estima ted from the dependences of T-C and T-R given above are almost the same. Th is is related to the fact that both processes are dominated by the thermal mobility of point defects. T-C was found to be always less than T-R, i.e., amorphization at an amorphous crystalline interface proceeds at somewhat hi gher temperatures where amorphization of crystalline material is no longer possible. (C) 2000 Elsevier Science B.V. All rights reserved.