3D probe for dimensional metrology on microsystem components

Measurement techniques adapted for dimensional metrology on microsystem com ponents are required increasingly. For this purpose a 3D tactile sensor has been developed using silicon micromachining technology and has been invest igated. We present results concerning 2D repeatability, linearity, resoluti on, and 3D crosstalk. Furthermore, forces during the contact process have b een measured. With the present type of sensor the realisation of a 3D measu rement uncertainty below 0.05 mu m is intended.