In contact with an environment, a solid may gain or lose mass due to, for e
xample, deposition or etching. As the reaction proceeds, the surface of the
solid moves, either extending or receding. If the solid is under stress, t
he elastic energy adds to the driving force of the reaction, and may cause
the surface to roughen. This phenomenon has recently led to a novel experim
ental technique to determine the stress state in a solid by using an atomic
force microscope to scan the surface profiles before and after etching. St
ress is also known to change the mobility of a reaction. By this mechanism,
the stress may either roughen or stabilize a flat surface. This article de
scribes a linear perturbation analysis of a three-dimensional solid surface
evolving under stress, using a general kinetic law. It is found that when
the reaction is near equilibrium, the stress effect on driving force domina
tes; when the reaction is far from equilibrium, the stress effect on mobili
ty dominates. Under these two conditions, the surface profile spectra have
different patterns and length scales. The implications for the stress measu
rement technique are discussed. It is suggested that the same experimental
procedure be used to measure surface energy and activation strains. (C) 200
0 American Institute of Physics. [S0021-8979(00)04303-6].