Temperature and microstructural dependence of the sensitivity of heterocontacts between zinc oxide and copper oxide in reducing environments

Authors
Tongpool, R Leach, C Freer, R
Citation
R. Tongpool et al., Temperature and microstructural dependence of the sensitivity of heterocontacts between zinc oxide and copper oxide in reducing environments, J MAT SCI L, 19(2), 2000, pp. 119-121
Citations number
6
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF MATERIALS SCIENCE LETTERS
ISSN journal
02618028 → ACNP
Volume
19
Issue
2
Year of publication
2000
Pages
119 - 121
Database
ISI
SICI code
0261-8028(200001)19:2<119:TAMDOT>2.0.ZU;2-8