Variation of polish pad shape during pad dressing

Authors
Zhou, YY Davis, EC
Citation
Yy. Zhou et Ec. Davis, Variation of polish pad shape during pad dressing, MAT SCI E B, 68(2), 1999, pp. 91-98
Citations number
13
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
ISSN journal
09215107 → ACNP
Volume
68
Issue
2
Year of publication
1999
Pages
91 - 98
Database
ISI
SICI code
0921-5107(199912)68:2<91:VOPPSD>2.0.ZU;2-1
Abstract
In silicon wafer polishing and CMP processes, polish pad dressing (conditio ning) is often used to restore pad performance. In this report, variation o f polish pad shape during dressing is studied by using diamond-plated cup w heels and sandpaper rings, respectively. Result shows that pad shape become s concave after certain amount of dressing. The concavity increases with dr essing time - longer dressing produces higher concavity. Moment induced by the frictional force between pad and dressing device is proposed to explain the pad shape variation. (C) 1999 Elsevier Science S.A. All rights reserve d.