Amorphous hydrogenated carbon a-C:H films, deposited on silicon substrates
by radio frequency plasma-enhanced chemical vapor deposition (RF PECVD), an
d AZ(R) 5214 organic photoresist have been etched in a low-pressure and hig
h frequency tetrafluoromethane (CF4) plasma. The etching of Si and SiO2 was
also measured in order to determine their selectivities to a-C:H films and
AZ 5214 photoresist. The etch rates were measured as a function of RF powe
r in the range of 20-60 W. Carbon a-C:H films were found to be more etch re
sistant than organic AZ 5214, Si, and SiO2. AZ 5214 demonstrated a relative
ly high etch rate (300-700 Angstrom/min). The best etch rate ratios of Si a
nd SiO2 to carbon films were achieved at low RF power. Carbon films can be
used as masks for deep pattern transfer to Si and SiO2 in photolithography.
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