A 30GHz-band transceiver multi chip module based on aluminum nitride

Citation
M. Akaishi et al., A 30GHz-band transceiver multi chip module based on aluminum nitride, NEC RES DEV, 41(1), 2000, pp. 59-63
Citations number
1
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
NEC RESEARCH & DEVELOPMENT
ISSN journal
0547051X → ACNP
Volume
41
Issue
1
Year of publication
2000
Pages
59 - 63
Database
ISI
SICI code
0547-051X(200001)41:1<59:A3TMCM>2.0.ZU;2-O
Abstract
A Super miniaturized and single packaged transceiver module whose size is 3 5mmx35mmx6mm has been successfully developed for LMDS (Local Multipoint Dis tribution Services). The module that can be directly connected to an antenn a consists of all of active circuits and the frequency duplexer by using th e newly developed drop-in circulator. An AIN (Aluminum Nitride) multi-layer LCC (Leaderless Chip Carrier) package was employed for the package in cons ideration of transmission loss and thermal management. The saturated output power of 23dBm, the phase noise of 91dBc/Hz at 100KHz off, and the receive r noise figure of 7.0dB are obtained at 30GHz band.