In a modern plasma etching device, the plasma sheath potential is usually s
uperposed by an externally driven oscillating voltage to enhance and contro
l the bombarding ion energy. A collisionless particle simulation is used to
study the variation of average kinetic energy < K >(nu(rf)) of bombarding
ions as a function of a wide range of sheath oscillation frequency nu(rf) (
0.1 nu(pi)less than or equal to nu(rf)less than or equal to 10 nu(pi), wher
e nu(pi) is the ion plasma frequency). It is found that a resonance phenome
non between the ion transit motion and the sheath oscillation can yield a s
trongly peaked enhancement of < K >(nu(rf)) near nu(rf)similar or equal to
0.5 nu(pi). Ion species with different mass show the peaks at different nu(
rf). The relative importance of different ion molecules in an ion-enhanced
etching process will be sensitive to nu(rf). This phenomenon may allow a re
duction of the undesirable capacitive coupling by optimizing nu(rf) to yiel
d an enhanced < K > of desired ion species at low applied voltages. (C) 200
0 American Institute of Physics. [S1070-664X(00)03702-2].