Fine trimming of SmS film resistance by XeCl laser ablation

Citation
P. Miodushevsky et al., Fine trimming of SmS film resistance by XeCl laser ablation, THIN SOL FI, 359(2), 2000, pp. 251-254
Citations number
13
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
THIN SOLID FILMS
ISSN journal
00406090 → ACNP
Volume
359
Issue
2
Year of publication
2000
Pages
251 - 254
Database
ISI
SICI code
0040-6090(20000131)359:2<251:FTOSFR>2.0.ZU;2-3
Abstract
The laser ablation threshold fluence of thin SmS films has been measured at 308 nm (XeCl excimer laser) by the photoacoustic beam deflection technique . Fine trimming of the SmS film resistance by pulsed XeCl laser ablation ha s then been demonstrated. In particular, it is shown that the film electric al resistance increases linearly with the number of laser shots at fluences above the ablation threshold fluence and that the increasing rate is quite dependent on the XeCl laser fluence. The resistance growth rate which was of 8 Omega/pulse at the laser fluence of 1.1 J/cm(2) has increased to 280 O mega/pulse at the laser fluence of 6.2 J/cm(2). The rate of material remova l was of 0.8 nm/pulse at 6.2 J/cm(2) and of 0.019 nm/pulse at 1.1 J/cm(2). (C) 2000 Elsevier Science S.A. All rights reserved.