A NEW ULTRASONIC MEASUREMENT SYSTEM FOR THE CURE MONITORING OF THERMOSETTING RESINS AND COMPOSITES

Citation
Dd. Shepard et Kr. Smith, A NEW ULTRASONIC MEASUREMENT SYSTEM FOR THE CURE MONITORING OF THERMOSETTING RESINS AND COMPOSITES, Journal of thermal analysis, 49(1), 1997, pp. 95-100
Citations number
4
Categorie Soggetti
Chemistry Analytical
Journal title
ISSN journal
03684466
Volume
49
Issue
1
Year of publication
1997
Pages
95 - 100
Database
ISI
SICI code
0368-4466(1997)49:1<95:ANUMSF>2.0.ZU;2-4
Abstract
Measurements of the ultrasonic sound speed of thermosetting resins and composites can be used as an in-process cure monitoring technique. Ul trasonic measurements have an advantage over other in-process techniqu es in that ultrasonic sensors do not make contact with the part (thus leaving no imbedded sensor or witness mark) and can make true bulk mea surements of the part. A new commercially available ultrasonic cure mo nitoring system has been developed which easily enables ultrasonic mea surements to be made in compression molding, resin transfer molding, a nd autoclave processes. Advancements in ultrasonic sensor technology e nable the sensor to maintain good coupling to the part during thermal cycling to 260 degrees C. Data is presented showing the change in ultr asonic sound speed during the compression molding of a graphite-epoxy prepreg. The data shows a good relationship to the ionic conductivity and resistivity data collected via dielectric cure monitoring.