A DYNAMIC DSC STUDY OF THE CURING PROCESS OF EPOXY-RESIN

In order to expand the industrial usefulness of an isothermal time-tem perature-transformation (TTT) cure diagram, a method to make it applic able to a solid-state sample involving only resins and a catalyst was studied by using dynamic DSC (DDSC) and cone plate dynamic mechanical analysis (DMA). To estimate how much curing occurred for an industrial ly used epoxy resin molding compound manufactured in a production proc ess was also studied, together with its position in the TTT cure diagr am. The TTT cure diagram proved to be useful for determining the diffe rences between compounds without their dissolution in a solvent, and f or estimating their heat history during the production process.