A New Approach for the study of chemical mechanical polishing

Authors
Devecchio, D Schmutz, P Frankel, GS
Citation
D. Devecchio et al., A New Approach for the study of chemical mechanical polishing, EL SOLID ST, 3(2), 2000, pp. 90-92
Citations number
5
Categorie Soggetti
Physical Chemistry/Chemical Physics
Journal title
ELECTROCHEMICAL AND SOLID STATE LETTERS
ISSN journal
10990062 → ACNP
Volume
3
Issue
2
Year of publication
2000
Pages
90 - 92
Database
ISI
SICI code
1099-0062(200002)3:2<90:ANAFTS>2.0.ZU;2-3
Abstract
The process of chemical mechanical polishing (CMP) can be studied using in situ atomic force microscopy (AFM) by intentionally using a high tip/sample interaction force. The nominal removal rate of Al during AFM scratching is studied under a range of conditions including varying tip/sample force, so lution pH, and electrode potential. This approach should bt? useful far CMP process development and furthering the fundamental understanding of CMP me chanisms. (C) 1999 The Electrochemical Society. S1099-0062(99)09-098-7. All rights reserved.