Effects of polysilicon gate doping concentration on plasma charging damagein ultrathin gate oxides

Citation
Cc. Chen et al., Effects of polysilicon gate doping concentration on plasma charging damagein ultrathin gate oxides, EL SOLID ST, 3(2), 2000, pp. 103-105
Citations number
9
Categorie Soggetti
Physical Chemistry/Chemical Physics
Journal title
ELECTROCHEMICAL AND SOLID STATE LETTERS
ISSN journal
10990062 → ACNP
Volume
3
Issue
2
Year of publication
2000
Pages
103 - 105
Database
ISI
SICI code
1099-0062(200002)3:2<103:EOPGDC>2.0.ZU;2-D
Abstract
Effects of poly-gate doping concentration on plasma charging damage in ultr athin gate oxides were investigated. While the charge-to-breakdown (Q(bd)) value under gate injection stress polarity (-V-g) is independent of the dop ing concentration, eb, under substrate injection stress polarity (+V-g) sho ws a noticeable improvement with increasing doping concentration. However, our results show that plasma-induced oxide degradation is actually aggravat ed with increasing poly-gate doping concentration. These seemingly inconsis tent observations can be explained by the lowering of plasma charging poten tial in the case of insufficient poly-gate doping. (C) 1999 The Electrochem ical Society. S1099-0062(99)10-079-8. All rights reserved.