STUDY OF CURING BEHAVIOR AND THERMAL-PROPERTIES OF ELASTOMER-MODIFIEDBISMALEIMIDE RESIN

Citation
S. Katiyar et Ak. Nagpal, STUDY OF CURING BEHAVIOR AND THERMAL-PROPERTIES OF ELASTOMER-MODIFIEDBISMALEIMIDE RESIN, Journal of thermal analysis, 49(1), 1997, pp. 177-182
Citations number
12
Categorie Soggetti
Chemistry Analytical
Journal title
ISSN journal
03684466
Volume
49
Issue
1
Year of publication
1997
Pages
177 - 182
Database
ISI
SICI code
0368-4466(1997)49:1<177:SOCBAT>2.0.ZU;2-5
Abstract
Bismaleimide resin (Compimide 353) was modified with the liquid elasto mer carboxyl-terminated acrylonitrile butadiene (CTBN). The prereactio n synthesis and curing of the CTBN-bis-maleimide resin is discussed. T he structure of the modified resin was identified by IR and NMR spectr oscopy. The basic curing mechanism is also discussed. DSC and TG were used to study the curing behaviour and kinetic parameters, viz. the or der of reaction, energy of activation and preexponential factor. Adhes ive properties such as lap shear strength and peel strength at room te mperature and elevated temperature were evaluated and are discussed.