S. Katiyar et Ak. Nagpal, STUDY OF CURING BEHAVIOR AND THERMAL-PROPERTIES OF ELASTOMER-MODIFIEDBISMALEIMIDE RESIN, Journal of thermal analysis, 49(1), 1997, pp. 177-182
Bismaleimide resin (Compimide 353) was modified with the liquid elasto
mer carboxyl-terminated acrylonitrile butadiene (CTBN). The prereactio
n synthesis and curing of the CTBN-bis-maleimide resin is discussed. T
he structure of the modified resin was identified by IR and NMR spectr
oscopy. The basic curing mechanism is also discussed. DSC and TG were
used to study the curing behaviour and kinetic parameters, viz. the or
der of reaction, energy of activation and preexponential factor. Adhes
ive properties such as lap shear strength and peel strength at room te
mperature and elevated temperature were evaluated and are discussed.