THERMOGRAVIMETRIC ANALYSIS OF A POLYCYANURATE THERMOSETTING MATERIAL

The thermal degradation of a fully cured polycyanurate thermosetting m aterial was examined by monitoring the mass loss at various temperatur es ranging from 200 to 220 degrees C. The effect of the copper naphthe nate catalyst, generally used to facilitate curing, is also studied. A decrease in weight is observed with increasing time at elevated tempe ratures in the systems containing copper naphthenate, with the onset o f degradation occurring sooner with higher concentrations of the coppe r compound. The apparent activation energy for degradation is 220+/-30 kJ mol(-1).