Single event gate rupture (SEGR) was studied using three types of power MOS
FET devices with ions having incident linear energy transfers (LETs) in sil
icon from 26 to 82 MeV.cm(2)/mg. Results are: 1) consistent with Wrobel's o
xide breakdown for V-DS = 0 volts (for both normal incidence and angle); an
d 2) when V-GS = 0 volts, energy deposited near the Si/SiO2 interface is mo
re important than the energy deposited deeper in the epi.