Ae. Wickenden et al., The influence of OMVPE growth pressure on the morphology, compensation, and doping of GaN and related alloys, J ELEC MAT, 29(1), 2000, pp. 21-26
Growth pressure has a dramatic influence on the grain size, transport chara
cteristics, optical recombination processes, and alloy composition of GaN a
nd AlGaN films. We report on systematic studies which have been performed i
n a close spaced showerhead reactor and a vertical quartz tube reactor, whi
ch demonstrate increased grain size with increased growth pressure. Data su
ggesting the compensating nature of grain boundaries in GaN films is presen
ted, and the impact of grain size on high mobility silicon-doped GaN and hi
ghly resistive unintentionally doped GaN films is discussed. We detail the
influence of pressure on AlGaN film growth, and show how AlGaN must be grow
n at pressures which are lower than those used for the growth of optimized
GaN films. By controlling growth pressure, we have grown high electron mobi
lity transistor (HEMT) device structures having highly resistive (105 Ohm-c
m) isolation layers, room temperature sheet carrier concentrations of 1.2 x
10(13) cm(-2) and mobilities of 1500 cm(2)/Vs, and reduced trapping effect
s in fabricated devices.