Thermal fatigue-resistant EMCs (Epoxy Molding Compounds) for microelectronic encapsulation

Highly thermal conductive EMCs (Epoxy Molding Compounds) should be consider ed for the alleviation of thermal stress-related problems caused by low the rmal conductivity, and high elastic modulus of EMCs and by a mismatch of CT E (Coefficient of Thermal Expansion) between EMCs and the Si-wafer. Compare d to crystal line silica-filled EMCs, alumina filled EMC improved the value of thermal conductivity by 100% and lowered the value of CTE by 50%. As a result, compared to typical crystalline silica-filled EMCs, the thermal fat igue resistance of alumina-filled EMC was improved by sixfold.