Cf. Wang et Ds. Tsai, Low pressure chemical vapor deposition of silicon carbide from dichlorosilane and acetylene, MATER CH PH, 63(3), 2000, pp. 196-201
The deposition of silicon carbide thin film on Si (1 0 0) wafer, using low
pressure CVD of SiH2Cl2/C2H2/H-2 reaction system, is investigated. The SiC
film deposited at 1023 K is amorphous, 1073 K is microcrystalline, and 1173
K is (1 1 0) preferentially oriented. The deposition rate increases signif
icantly with temperature. Deposition kinetics of surface and gas-phase path
s is separated by varying the volume/surface ratio of deposition environmen
t. The activation energy for gas-phase reaction path is estimated to be 76
kcal/mol, and that for surface reaction path is 71 kcal/mol. The experiment
al barrier for gas-phase reaction path is close to the values by ab initio
calculation (Su and Schlegel), which range from 73 to 76 kcal/mol for the s
tep of Hz elimination from SiH2Cl2. (C) 2000 Elsevier Science S.A. All righ
ts reserved.