The effect of the presence of a wetter upon nickel electroforming of three-
dimensional (3D) microstructure under various aspect ratios and applied cur
rent densities was investigated. Owing to improved wetting capacity, the he
ight-to-width aspect ratio of the nickel microstructure and the applied cur
rent density were favorably enhanced with the presence of soluble dialkyl e
sters of sodium sulfosuccinic acid in the electrolyte. A nickel microstruct
ure with aspect ratio 30 (200 mu m deep with 7 mu m width) was obtained at
16 A dm(-2). The internal stress and hardness of the nickel deposit were sl
ightly decreased by the presence of these wetters, (C) 2000 Elsevier Scienc
e S.A. All rights reserved.