Stress evolution and drift kinetics in confined metal lines

Citation
Sa. Chizhik et al., Stress evolution and drift kinetics in confined metal lines, MICROEL ENG, 50(1-4), 2000, pp. 341-347
Citations number
3
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONIC ENGINEERING
ISSN journal
01679317 → ACNP
Volume
50
Issue
1-4
Year of publication
2000
Pages
341 - 347
Database
ISI
SICI code
0167-9317(200001)50:1-4<341:SEADKI>2.0.ZU;2-N
Abstract
A model describing stresses and vacancy system evolution and also drift phe nomena caused by electromigration (EM) in metal interconnectors has been pr oposed. It is shown that the drift kinetics has three main stages, i.e., in duction period, quasi-stationary and stationary state. Induction period is characterised by an increase in the stress at the ends of a conductor; drif t is absent. Drift begins when the yield limit is achieved at the cathode e dge of the conductor. Drift rate increases, reaches a maximum and then decr eases down to the stationary value. Characteristic times for all the stages are determined. Also, the effect of the length of the conductor on drift k inetics is analysed. (C) 2000 Elsevier Science B.V. All rights reserved.