Self-annealing characterization of electroplated copper films

Self-annealing of electro-chemically deposited copper films is described an d studied, with a focus on the effect of process parameters like concentrat ion of the organic additives, current density or thickness of plated copper . Sheet resistance and stress have been monitored and a non-correlated beha vior has been observed for these two film characteristics, indicating that other phenomena than the grain growth typically associated with the room te mperature recrystallization are likely to be involved. Diffusion/desorption of carbon containing molecules incorporated in the copper film from the ba th additives could be a mechanism for stress release. (C) 2000 Elsevier Sci ence B.V. All rights reserved.