V. Zaporojtchenko et al., Formation of metal-polymer interfaces by metal evaporation: influence of deposition parameters and defects, MICROEL ENG, 50(1-4), 2000, pp. 465-471
Metal-polymer interfaces with different but well defined morphologies were
prepared by evaporating noble metals (Au, Ag, Cu) onto chemically different
polymers, i.e. bisphenol-trimethyl cyclohexane polycarbonate (TMC-PC), pyr
omellitic dianhydride-oxydianiline (PMDA-ODA) polyimide (PI), polystyrene (
PS) and the low-k dielectric Teflon AF 1601. The interfaces were characteri
sed using transmission electron microscopy (TEM), X-ray photoelectron spect
roscopy (XPS) and atomic force microscopy (AFM). The combination of these t
echniques allowed one to determine morphological parameters such as concent
ration and distribution of metal clusters at the surface and in the near-su
rface region. In addition, radiotracer measurements yielded exact metal con
densation coefficients C and was used to determine the extent of diffusion
of metal atoms into the polymers. First experiments on the macroscopic adhe
sion of Cu on TMC-PC showed that the initially low peel strength can be inc
reased substantially by subsequent annealing above the polymer glass transi
tion temperature, T-g. (C) 2000 Elsevier Science B.V. All rights reserved.