Uhp. Fischer et al., New reconfigurable fiber-chip coupling method for multipurpose packaging with up to 50 GHz modulation bandwidth, OPT FIBER T, 6(1), 2000, pp. 68-73
We desired and fabricated a series of modules for one-sided and double-side
d fiber-chip coupling of waveguide-fed InP and GaAs OEICs such as diode Las
ers, semiconductor amplifiers, and optical modulators. Simultaneous couplin
g of both chip sides to the fiber is possible with a new patented set-up. T
he modules are temperature controlled within an ambient temperature range f
rom -10 to +50 degrees C and electrical modulation signals up to 45 GHz can
be fed via RF connectors to the OEIC. The coupling loss is typically less
than 3 dB with tapered fibers. The package shows good longterm stability an
d is well suited for prototypes and small-scale production. (C) 2000 Academ
ic Press.