New reconfigurable fiber-chip coupling method for multipurpose packaging with up to 50 GHz modulation bandwidth

We desired and fabricated a series of modules for one-sided and double-side d fiber-chip coupling of waveguide-fed InP and GaAs OEICs such as diode Las ers, semiconductor amplifiers, and optical modulators. Simultaneous couplin g of both chip sides to the fiber is possible with a new patented set-up. T he modules are temperature controlled within an ambient temperature range f rom -10 to +50 degrees C and electrical modulation signals up to 45 GHz can be fed via RF connectors to the OEIC. The coupling loss is typically less than 3 dB with tapered fibers. The package shows good longterm stability an d is well suited for prototypes and small-scale production. (C) 2000 Academ ic Press.