Electromagnetic shielding of plastic packaging in low-cost laser modules

Citation
Wh. Cheng et al., Electromagnetic shielding of plastic packaging in low-cost laser modules, ELECTR LETT, 36(2), 2000, pp. 118-119
Citations number
4
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
ELECTRONICS LETTERS
ISSN journal
00135194 → ACNP
Volume
36
Issue
2
Year of publication
2000
Pages
118 - 119
Database
ISI
SICI code
0013-5194(20000120)36:2<118:ESOPPI>2.0.ZU;2-T
Abstract
Low-cost MiniDIP laser modules fabricated by plastic moulded technology fil led with highly conductive materials are proposed for the evaluation of ele ctromagnetic interference (EMI) shielding effectiveness (SE). The SE of con ductive plastics was measured to be 45dB at 30MHz and 62dB at 1GHz. The las er modules have a transmission speed up to 622 Mbit/s and > 1mW fibre outpu t power. With these excellent SEs and good optical characteristics, such pl astic MiniDIP laser modules;fire suitable for use in low cost OC-12 lightwa ve transmission systems.