Adhesively bonded assemblies with identical nondeformable adherends and 'piecewise continuous' adhesive layer: predicted thermal stresses in the adhesive

We consider a thermoelastic problem for an elongated adhesively bonded asse mbly with identical nondeformable adherends and a 'piecewise continuous' ad hesive layer: the adhesive layer consists of a large number of 'pieces' tha t differ by their lengths, Young's moduli, Poisson's ratios, and coefficien ts of thermal expansion. Assemblies of this type are of interest in connect ion with the manufacturing, and mechanical and optical performance of some photonics structures. We develop a stress analysis model for the evaluation of thermally induced stresses, strains and displacements in the adhesive l ayer. These stresses are due to the thermal expansion (contraction) mismatc h of the adhesive material with the material of the adherends, as well as t o the mismatch between the adjacent 'pieces' of the adhesive layer. (C) 200 0 Elsevier Science Ltd. All rights reserved.