The removal of deformed submicron particles from silicon wafers by spin rinse and megasonics

In order to successfully clean particulate contamination from wafer surface s, it is necessary to understand the adhesion and deformation between the p articles and the substrate in contact. The adhesion and removal mechanisms of deformed submicron particles have not been addressed in many previous st udies. Submicron polystyrene latex particles (0.1-0.5 mu m) were deposited on silicon wafers and removed by spin rinse and megasonic cleanings. Partic le rolling is identified as the major removal mechanism for the deformed su bmicron particles from silicon wafers. Megasonics provides larger streaming velocity because of the extremely thin boundary layer resulting in a large r removal force that is capable of achieving complete removal of contaminat ion particles.