We have investigated the effect of high-temperature annealing on device per
formance of GaInP/GaAs HBTs using a wide range of MOVPE growth parameters f
or the C-doped base layer. Carbon doping was achieved either via TMG and As
H3 only or by using an extrinsic carbon source. High-temperature annealing
causes degradation of carbon-doped GaAs in terms of minority carrier proper
ties even at doping levels of p = 1 x 10(19) cm(-3). The measured reduction
in electron lifetime and luminescence intensity correlates with HBT device
results. It is shown that the critical temperature where material degradat
ion starts is both a function of doping method and carbon concentration.