A double-chamber capacitively coupled RF discharge for plasma assisting deposition techniques

A double-chamber capacitively coupled RF discharge, suitable for assisting with plasma a large variety of deposition techniques (ablation, CVD, etc.) is described. The special discharge configuration avoids the presence of in ternal electrodes in the deposition chamber, the plasma sustaining being he lped by the grounded walls of the deposition chamber. The plasma is easy to be created and can cover large volumes. For appropriate discharge configur ation and values of the working parameters, assistance with a directional p lasma flow or long life afterglow species can be realized. (C) 2000 Elsevie r Science Ltd. All rights reserved.