Demonstration of a multichannel optical interconnection by use of imaging fiber bundles butt coupled to optoelectronic circuits

Through five experiments, we demonstrate and characterize the basic functio nality of imaging fiber bundles for optoelectronic chip-level interconnecti ons. We demonstrate the transmission of spot arrays with spot sizes and a s pot pitch roughly equal to 2 and 4 times the core pitch, respectively. We s how that optoelectronic integrated circuits, including sources and detector s, carl be butt coupled directly to fiber bundles without any additional op tical elements. We demonstrate a 16-channel interconnect with -23 dB of cro ss talk, and we characterize the most significant optical loss mechanism. F inally, we show how imaging fiber bundles can be used to implement more com plex interconnection structures by an example of a hybrid-bonded structure that implements a low-cost, high-connectivity solution for mole advanced sy stem architectures. (C) 2000 Optical Society of America.