The effects of some new organic additives, such as horse-chestnut extract (
HCE) and a mixture of ethoxyacetic alcohol and triethyl-benzyl-ammonium chl
oride (IT-85) upon the morphology and structure of copper deposits, as well
as upon the cathodic polarization, are investigated and compared to those
exerted by thiourea and animal glue, in the case of pure, synthetic sulphat
e solutions. The additive IT-85 was found to be an efficient inhibitor of t
he copper electro-crystallization process, leading to levelled, fine graine
d cathodic deposits with a strong [110] texture. The effects of HCE were si
milar to those exerted by animal glue, leading to deposits consisting of ro
unded nodules, without a clear texture, reflecting a smaller levelling effe
ct. (C) 2000 Elsevier Science B.V. All rights reserved.