Mapping of wafer profile to plasma processing conditions: Forward and reverse maps

Authors
Lane, J Rietman, EA Layadi, N Lee, JTC
Citation
J. Lane et al., Mapping of wafer profile to plasma processing conditions: Forward and reverse maps, J VAC SCI B, 18(1), 2000, pp. 299-302
Citations number
13
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
ISSN journal
10711023 → ACNP
Volume
18
Issue
1
Year of publication
2000
Pages
299 - 302
Database
ISI
SICI code
1071-1023(200001/02)18:1<299:MOWPTP>2.0.ZU;2-X