K. Wittmaack et al., In search of optimum conditions for the growth of sharp and shallow B-delta markers in Si by molecular beam epitaxy, J VAC SCI B, 18(1), 2000, pp. 524-528
Multiple boron delta spikes in silicon, with spacings between 4.3 and 20 nm
, have been grown by molecular beam epitaxy at temperatures of about 100 de
grees C (LI) and 400 degrees C (S4). The test samples were depth profiled b
y secondary ion mass spectrometry using 500 eV O-2(+) at normal beam incide
nce. The surface of S4 was guile smooth, with a root mean square roughness
sigma<0.1 nm. By contrast, L1 was rather rough, sigma congruent to 0.5 nm.
The boron depth profiles of S4 revealed sharp peaks but pronounced tails on
either side. The tails, which dominate the dopant distributions at concent
rations below about 40% of the peak level, are attributed to defect-promote
d boron diffusion during growth. Sample L1 showed boron spikes of larger wi
dth above the 10%-20% peak level, but a much more rapid, roughly exponentia
l falloff on both sides. This sharpness of the dopant spikes implies the ab
sence of boron diffusion during low-temperature growth. The "best" deltas (
those with small width and sharp falloff) were obtained with boron contamin
ants of ambient origin that resided at the (oxidized) interface between the
substrate and the silicon buffer layer. This observation suggests that bor
on atoms in silicon dioxide are rather immobile. Depth profile measurements
on crystalline samples, either containing boron deltas or being uniformly
doped with boron, revealed severe variations of the B+ signal over a depth
of up to 25 nm at normal and oblique beam incidences (up to 50 degrees, als
o with oxygen flooding). Silicon matrix signals measured in parallel diet n
ot show any variation beyond the transient depth. The initial overshoot of
the B+ signal, observed just below the transient depth, sometimes exceeded
the stationary signal by more than a factor of 2, and the signal undershoot
in extended regions at larger depths was low by up to several 10%. This ar
tifact calls for recalibration of previously reported profiles of shallow b
oron implantations in silicon. (C) 2000 American Vacuum Society. [S0734-211
X(00)06501-X].