Tn this article, we report our progress in two-dimensional (2D) dopant prof
iling of metal-oxide-semiconductor field effect transistor devices fabricat
ed with 0.2 mu m technology by using dopant selective etching followed with
atomic force microscope imaging (DSE/AFM). By comparing device simulation
results based on our measurement with electrical measurement results, we ha
ve found that in these small devices the depletion region can have a signif
icant effect on the results of dopant concentration conversions from the se
lective etching data, and the necessary correction can be found by a. prope
r estimation of the depletion width. Here we discuss the factors that affec
t the etching reproducibility and reliability and show our approaches to th
ese challenges, Our results show Chat DSE/AFM is a useful technique far 2D
dopant profiling with certain advantages if it is dealt with properly. (C)
2000 American Vacuum Society. [S0734-211X(00)01601-2].