In this article we describe a newly proposed and consistent damage model in
Monte Carlo simulation for the accurate prediction of a three-dimensional
as-implanted impurity profile and point defect profile induced by ion impla
ntation in (100) crystal silicon. An empirical electronic energy loss model
for B, BF2, As, P, and Si self-implants over a wide energy range has been
proposed for silicon-based semiconductor device technology and development.
Our model shows very good agreement with secondary ion mass spectrometry d
ata over a wide energy range. For damage accumulation, we have considered t
he self-annealing effects by introducing our proposed nonlinear recombinati
on probability function of each point defect for computational efficiency.
For the damage profiles, we compared the published Rutherford backscatterin
g spectrometry (RBS)/ channeling data with our results of phosphorus implan
ts. Our damage model shows very reasonable agreements with the RBS/channeli
ng experiments for phosphorus implants. (C) 2000 American Vacuum Society. [
S0734-211X(00)09001-6].