Improving the dimensional accuracy along the optical axis without decreasin
g the materials removing rate is a key issue in three-dimensional laser sha
ping. This paper presents a concept for performing three-dimensional laser
shaping by directly using machining laser as the photo source of the non-co
ntacting measuring device. Due to the high power measuring photo sourer and
a 1.06 mu m bandpass filter. the interference caused by the emission light
of ablated surface can be effectively avoided, the delay time is not neede
d to be inserted between the laser pulse and the measurement. So the measur
ement will not decrease the material removal rate and productivity. By usin
g this system, the shaping accuracy of 30 mu m can be achieved at the remov
ing rate of about 4.0 x 10(-2) mm(3)/sec for Si3N4 ceramic, both are much b
etter than the results obtained before. (C) 2000 Elsevier Science Ltd. All
rights reserved.